TREATOFLEX: Atmospheric pressure nonthermal plasma reactor for preTREATment of pOlymeric substrates used in printable FLEXible electronics manufacturing
Start date: January 1, 2020
End date: December 31,2021
The main objective of the project is to develop a process of pretreatment of difficult substrates by plasma at room temperature for electronic applications printed by screen printing and inkjet. The development of the pretreatment will be carried out by the partners of the “Gheorghe Asachi” Technical University of Iasi. NAITEC´s works will be the validation in applications of electronics printed by inkjet technology both in plan and using the R2R pilot plant available at NAITEC. For this reason, in this project NAITEC will also develop a conductive inkjet ink with properties adapted to the substrates that will be treated with the prototype developed by the Romanian partners. Devices to be developed by NAITEC include capacitive sensors, antennas, printed heaters, and hybrid circuits.
More information: http://www.treatoflex.ieeia.tuiasi.ro/